Channel-to-Pin and Channel-to-Duct Heat Transfer Modeling

The pin surface temperature are computed via the convective heat transfer coefficient as follows:

where:

  • is the surface temperature for the pin at a height

  • is the number of subchannels neighboring the pin

  • is the bulk temperature for a subchannel neighboring the pin at a height

  • is the linear heat generation rate for the pin at a height

  • is the pin diameter at a height

  • is the convective heat transfer coefficient for the subchannel next to the duct node at a height

For the duct, the duct surface temperature is defined as follows:

where:

  • is the duct surface temperature at a height

  • is the bulk temperature of the subchannel next to the duct node

  • is the heat flux at the duct at a height

  • is the convective heat transfer coefficientfor the subchannel next to the duct node at a height

In both cases, the convective heat transfer coefficients are computed using the Nusselt number (Nu) as follows:

where:

  • is the local thermal conductivity of the fluid in the subchannel neighboring the structure

  • is the hydraulics diameter of the subchannel neighboring the structure

The modeling of the Nusselt number and consequently of the convective heat transfer coefficient h is selected by the user through a closure. The closure models available to the user that are implemented in SCM are the following:

All these models inherit from the base class: SCMHTCClosureBase. A synopsis of the closure models availabe in SCM with the range of validity, is presented in Table HTC models.

commentnote

Currently there is no subchannel-to-duct heat transfer model implemented for square assemblies (square ducts). It only exists for hexagonal assemblies (hexagonal ducts). The subchannel-to-pin model is available for both hexagonal and square assemblies.